Technology
UltraSPARC III Cu technology features include:
• 0.18 u, 7-layer Cu metal, CMOS process
• 1.6 V core and 1.5 V I/O power supplies
• 232 mm2 die size
• 1368 pin ceramic LGA package
• 900 MHz and higher frequency
• 80 W power dissipation at 900 MHz |